Solder paste is also known as
solder cream which is used to fix leads on surface mounted IC chips to the
attachment points on the printed circuit boards (PCB), which are usually used
in almost all electronic devices. The solder paste is normally applied as a
paste with the help of dispensing tubes or stencil on the leads on PCBs, which
is followed by heating the paste in order to melt and complete the connection.
It is a grey and putty-like material and an exceptionally significant
ingredient in the manufacturing of electronic circuit. They are of different
compositions subject to their end user requirements. Few of the common solder
pastes include tin – silver – copper alloy, tin – antimony alloy, tin – lead
alloy, and tin – silver – copper alloy.
Growing demand for electronic
manufacturing services is expected to augment the demand for solder paste
market over the next eight years. The solder paste market has specially
witnessed a bullish run in the last two decades, is anticipated to grow further
with the diffusion of information technology, and enabled services in human
life globally. Solder paste is vital for all semiconductors and printed circuit
boards.
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They find application in nearly all electronic devices including
laptops, tablets, medical testing equipment, nuclear detection systems, weather
analysis equipment, computers, smart phones, televisions, fiber optic
receptors, and data storage devices among many others. PCBs are also used
in automotive, aerospace, and marine vehicles industry for electronic
functions. Old-fashioned single layer PCBs are progressively evolving into
multilayer PCBs with wide functionality. The technological improvement in the
printed circuit board market is expected to augment the demand for solder paste
over the forecast period.
The solder paste market is mostly
hindered by its substitute products. Though, the demand for lead-free solder
paste has been growing owing to environmental concerns of lead. According to
estimations, more than 30.0 million tons of electronic wastes are accumulated
every year and the lead content in electronic wastes creates havoc on
environmental balance. Lead-containing alloys demand is anticipated to decline
over the forecast period. However, there are no such significant limitations to
the solder paste market as a whole.
Geographically, the solder paste
market is segmented into North America, Asia-Pacific, Latin America, Middle
East and Africa, and Europe. The global outlook for electronic equipment and
its applications holds potential as consumer electronics has witnessed
remarkable growth in the recent past and is expected to rise in the near
future. This presents an incredible opportunity for solder paste market
particularly in the developing regions of Latin America, Africa, and Asia
Pacific.
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China accounts for the major
demand for solder paste and is the largest manufacturer of electronic devices
and ancillary parts globally. The demand for solder paste is anticipated to
surge in this region over the forecast period owing to export related
electronics manufacturing services. China is the foremost manufacturer of
solder paste globally. Asia Pacific accounts for over 50.0% of the global
demand, led by China, Korea, India, and Japan. The key players dominating the
market for solder paste include Kester, AIM Metals and Alloys, LLC, Ku Ping
Enterprise Co., Ltd., Dyfenco Electronic Chemical Corporation, while other
significant players include SMT International LLC, Chung I Silver Solder Co.,
Ltd., Chemco Industry Corporation, and Shenmao Technology Inc., among several
others
This report covers each aspect of
the global market for solder paste, beginning from the basic market information
and progressing further to several significant criteria, based on which, the
solder paste is segmented. Key application areas of solder paste are also
evaluated on the basis of their performance. The solder paste industrial chain,
prevailing policies, and rules & regulations are studied in this report.
The report also assesses the dynamics of demand and supply, production
capacity, logistics, and the historical performance of the solder paste
globally.
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